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Next Gen Nintendo Console Specs Allegedly Leaked, Dubbed “Nintendo Fusion”

The folks over at Nintendo News posted an article with specs of what could be Nintendo’s next generation console. There will apparently be two devices bundled together, a “Fusion Terminal” and a “Fusion DS” which would allow you to play at home and on the go.  The specs are much better than what one would normally expect from Nintendo so they could just be made up but we won’t know until Nintendo officially unveils the console. As awesome as it would be for Nintendo to announce the console this year, it is most likely to happen at E3 2015 0r 2016. Check out the specs below and a video from Inside Gaming going into further detail…

Fusion Terminal

  • GPGPU: Custom Radeon HD RX 200 GPU CODENAME LADY (2816 shaders @ 960 MHz, 4.60 TFLOP/s, Fillrates: 60.6 Gpixel/s, 170 Gtexel/s)
  • CPU: IBM 64-Bit Custom POWER 8-Based IBM 8-Core Processor CODENAME JUMPMAN (2.2 GHz, Shared 6 MB L4 cache)
  • Co-CPU: IBM PowerPC 750-based 1.24 GHz Tri-Core Co-Processor CODENAME HAMMER
  • MEMORY: 4 Gigabytes of Unified DDR4 SDRAM CODENAMED KONG, 2 GB DDR3 RAM @ 1600 MHz (12.8 GB/s) On Die CODENAMED BARREL
  • 802.11 b/g/n Wireless
  • Bluetooth v4.0 BLE
  • 2 USB 3.0
  • 1 Coaxial Cable Input
  • 1 CableCARD Slot
  • 4 Custom Stream-Interface Nodes up to 4 Wii U GamePads
  • Versions with Disk Drive play Wii U Optical Disk (4 Layers Maximum), FUSION Holographic Versatile Disc (HVD) and Nintendo 3DS Card Slot
  • 1 HDMI 2.0 1080p/4K Port
  • Dolby TrueHD 5.1 or 7.1 Surround Sound
  • Inductive Charging Surface for up to 4 FUSION DS or IC-Wii Remote Plus Controllers
  • Two versions: Disk Slot Version with 60 Gigs of Internal Flash Storage and Diskless Version with 300 Gigs of Internal Flash Storage

Fusion DS

  • CPU: ARMv8-A Cortex-A53 GPU: Custom Adreno 420-based AMD GPU
  • COM MEMORY: 3 GB LPDDR3 (2 GB Games, 1 GB OS)
  • 2 130 mm DVGA (960 x 640) Capacitive Touchscreen
  • Slide Out Design with Custom Swivel Tilt Hinge
  • Upper Screen made of Gorilla Glass, Comes with Magnetic Cover
  • Low End Vibration for Gameplay and App Alerts
  • 2 Motorized Circle Pads for Haptic Feedback
  • Thumbprint Security Scanner with Pulse Sensing Feedback
  • 2 1mp Stereoptic Cameras
  • Multi-Array Microphone
  • A, B, X, Y, D-Pad, L, R, 1, 2 Buttons
  • 3 Axis Tuning Fork Gyroscope, 3 Axis Accelerometer, Magnetometer
  • NFC Reader
  • 3G Chip with GPS Location
  • Bluetooth v4.0 BLE Command Node used to Interface with Bluetooth Devices such as Cell Phones, Tablets
  • 16 Gigabytes of Internal Flash Storage (Possible Future Unit With 32 Gigabytes)
  • Nintendo 3DS Cart Slot
  • SDHC “Holographic Enhanced” Card Slot up to 128 Gigabyte Limit
  • Mini USB I/O
  • 3300 mAh Li-Ion battery

Source: NintendoNews

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Hello internet I’m Daniel. I’ve always had a passion for gadgets and gizmos. My life took a turn for the best when I bought the First Generation iPod Nano the day Apple released it. I was amazed at how technology was becoming part of our daily lives and how fast new products were being developed. Since then I have grown to love technology related products, how they work, and how these products can be improved. I love providing my thoughts on companies latest products so consumers can make up their mind on whether or not they want to spend their money on them.

  • matt

    Sounds like Nintendo are going to bring this beast out in 2016 and fuse wiiu into it so wiiu owners don’t feel robbed interesting,them specs are like 20 times as powerful as xbox1/wiiu/ps4 ect easy a power8 cpu 8 cores wow………..i hope they release it so Nintendo gamers have ultra high end gaming with 4k options ect,as well as ps4/wiiu level yes i see them as the same wiiu has 563.2GB of bandwidth ram that’s not weak………